Highlights:
- MediaTek announces Dimensity 8400
- Features an All-Big Core setup with up to 3.25 GHz speed
- 41 percent better multi-core performance
- 44 percent better energy efficiency in peak performance
- NPU 880 for higher AI capabilities
- Supports LLM/SLM/LMMs
MediaTek has announced its new upper-midrange chipset Dimensity 8400 that will fit into premium smartphones in 2025. The system-on-a-chip (SoC) runs in the footsteps of Dimensity 9400 and features an All-Big Core setup, the first of its type in its class, and more power to boost artificial intelligence (AI) features. If you are waiting for a new phone with a MediaTek CPU-powered device, you may need to know more about it. Below, we have more details.
The best features of MediaTek Dimensity 8400
All -BIG Cores
The Dimensity 8400 chipset comes with an eight-core Arm Cortex-A725 processor. Being all Big-Core means that all these eight cores run up to the speed of 3.25 GHz in speed. To compare, it’s a 41 percent higher multi-core performance improvement over its predecessor Dimensity 8300.
But that’s not all. Each new-generation CPU improves its energy efficiency and it’s no exception here as well. The Dimensity 8400 offers 44 percent better power management even in peak usage over the previous-generation chipset.
Also, the new-generation chipset is mated to a new and powerful NPU that speeds up Gen-AI tasks while the new Dimensity Agentic AI Engine (DAE) converts traditional AI apps into “sophisticated agentic AI applications.” We have more on the AI part below down the passages.
Gaming
The high-flying midrange chipset also dominates the gaming scene with immersive experience backed by Arm Mali G720 GPU which provides 24 percent higher peak performance and 42 percent higher power efficiency. The screen with this chipset underneath supports WQHD+ display resolution with up to 144 Hz refresh rate and dual-screen.
The GPU coordinates with MediaTek’s Frame Rate Converter (MFRC) technology which contributes with smoother gameplay. Likewise, the MediaTek Adaptive Gaming Technology (MAGT) 3.0 promises better game and app optimization for uninterrupted and well-optimized gaming.
Artificial Intelligence
The NPU 880 in Dimensity 8400 supports LLM/SLM/LMMs for generative AI apps which unleashes use cases such as translation, rewriting, contextual replies, recording, and media generation. Thanks to these capabilities, more smartphones will be capable of running AI features in 2025.
The chipset incorporates MediaTek’s DAE which lets developer create agentic AI apps that can figure out user needs and adapt to their use behaviors.
“MediaTek is redefining premium smartphone experiences with the Dimensity 8400, unleashing creativity with generative and agentic AI applications and taking mobile gaming even further,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business Unit. “Our All-Big Core design, which we’ve also integrated into our flagship chips, highlights the impressive performance and efficiency that can go hand-in-hand so consumers don’t have to compromise.”
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Photography
The Dimensity 8400 comes with a built-in Imagiq 1080 ISP that offers QPD remosaic technological advantages that enable cameras to capture more light and focus better and more accurately. Expect to catch even higher-resolution images with a smartphone powered by this chipset.
Additionally, it also supports HDR recording while zooming in.
Connectivity
The chipset is integrated with a 5G-A modem (in other words: 5G Advanced or 5.5G) which unleashes up to 5.17 Gbps data speed. Likewise, the Network Observation System (NOS) technology precisely carries out 5G/WiFi switching for a better connectivity experience. It’s a 5G chipset and will be used in 5G smartphones
First smartphones with Dimensity 8400
So far, Redmi Turbo 4 is confirmed to launch with MediaTek 8400 chipset. The device will be the first launch of 2025 with this new chipset and we expect Xiaomi to customize the chipset’s name with an “Ultra” suffix. Given the popularity and how MediaTek plans to stir the smartphone market with this silicon, more OEMs like OPPO, realme, etc. will definitely integrate their products with it.
Dimensity 8400 seeks to give stiff competition to Qualcomm’s Snapdragon 7+ Gen 3 thanks to its All-Big core architecture.
